Other Parts Discussed in Thread: UCC27201A
Power SOIC-8 package mechanical data and recommended footprint is missing.
Please add this in datasheet.
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Power SOIC-8 package mechanical data and recommended footprint is missing.
Please add this in datasheet.
Hello Abhi,
Thank you for pointing out some of the information on the DDA package is missing on the UCC27201A-Q1 datasheet.
I checked the UCC27201A datasheet and the DDA full package information is included and is the same as the UCC27201A-Q1. The datasheet can be found here: http://www.ti.com/lit/ds/symlink/ucc27201a.pdf
Regards,
Hello Abhi,
As I mentioned in the 1st response, I did confirm that the UCC27201A-Q1 datasheet does not have the proper DDA package, SOIC Power Pad, information included in the datasheet. The correct package information is in the UCC27201A datasheet, which is the non Q1 version, the package information is the same. Please refer to the UCC27201A datasheet for the package information.
I will notify the documentation department to correct the UCC27201A-Q1 datasheet. But this usually takes some time for the update.
Please confirm if this addresses your question, or you can post additional questions on this thread.
Regards,