2.1 Test description
Three pieces of old date code ICs (D/C 1706) were submitted to QE lab to do solderability test.
2.2 Test method
Refer to IPC J-STD-002E Test B1, the dip and look test shall be performed on the samples.
The test conditions are shown as follows
A) Composition of Solder: Sn96.5Ag3.0Cu0.5
B) Solder Temperature: 245℃
C) Dwell Time: 5 seconds
D) Immersion Rate: 25mm/s
E) Flux: 74.61%±0.5% by weight of isopropyl alcohol, 25%±0.5% by weight of colophony and 0.39%±0.01% by weight of diethylammonium hydrochloride
3 Observations
Dewetting was found for sample 1 and 3.
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