Hi,
We are using 4 nos of TPS53515RVET for generating 4 nos of 3.3V in our board design and we have finished Layout activities. Now we are checking the Thermal analysis of the design by doing Thermal analysis.
We observe hot spot on these 4 ICs. Without considering Fan, junction temperature comes up to be 250 deg C and with fan of speed 1000ft/min Tj comes down to nearly 127 deg C.
Before put down my question, I will mention the design considerations below. These values are considered as electrical inputs in the simulation tool:
Output Voltage : 3.3V
Output current : 6A
Efficiency : 90%
Input Voltage : 12V
Input Current : nearly 2A
Power dissipation : 2.2W
Theta JC : 34.
Maximum Ti allowed : 150 deg C
In layout we have provided the proper thermal pad and thermal vias and Ground shapes (there are 4 GND layers in the stackup). And also parameters are properly entered in the tool too.
In spite of all these cares taken, why the junction temperature is going to 250 degC (in the absence fan) ? Whether the design considerations are correct or is there any flaw in the design considerations as mentioned above?
I am checking is there any layout issue or Simulation Tool related issue. Through this forum I just wanted to confirm whether the parameters considered as above make logical sense.
I am also attaching the TI Webench design report as per which the schematics is designed.TPS53515RVER_3.3VFPGA.pdf
Regards,
Vijetha