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TPS7B82-Q1: thermal resistance between junction to solder pad(thermal pad pin) for TPS7B8233QDGNRQ1 package.

suresh kumar sanaboyina
Prodigy 10 points
Part Number: TPS7B82-Q1

Hello TI,

We are using this package for automotive application. 

Actually I'm looking for thermal resistance between junction to solder pad

In datasheet thermal information table below details are given 

Junction to board thermal resistance is 22.6°C/W

Junction to case (bottom) thermal resistance is 12.1°C/W

what is the difference between above two parameters? 

could you please give me information about Rth(j-sp) - Thermal resistance between junction to solder pad (thermal pad pin) for TPS7B8233QDGNRQ1 package.

Thank you 

  • 0
    TI__Mastermind 23361 points

    Hi Suresh,

    If you follow the thermal metrics application note, which can be found here: http://www.ti.com/lit/an/spra953c/spra953c.pdf, you could find the difference between Rth-jb and Rth-jc in Chapter 4 on Page 10; you may also look at Chapter 2 on Page 6 for detailed explanations on Rth-jc.


    Rth(j-sp), as you defined, may not be directly calculated from the thermal metrics provided on datasheet as it needs to have the thermal resistance of the soldering itself. In the same application note, you can find some discussion about Rcs which will need to be measured to calculate the thermal resistance between junction to the solder pad. Does it make sense?


    Regards,
    Jason Song