LMZM23601: Does this come or can we get this part in a leaded version for the balls (SN63 for example)? If not, is there any issue in re-balling this part with SN63?

Nicholas Layshot4

Part Number: LMZM23601

We have leaded solder requirement and was wondering if this part can come in or we can get this part in a leaded ball version (SN63 for example)? Also, would there be any issue in re-balling this part with SN63?

over 6 years ago

0 Jimmy Hua over 6 years ago

TI__Guru 50120 points

Hi Nicholas,

I will have at contact the quality engineer to see if this re-balling process may be an issue or not. So far the LMZM23601 only comes in a uSIP package and does not come as a leaded version.

Regards,

Jimmy

0 Denislav Petkov over 6 years ago in reply to Jimmy Hua

TI__Mastermind 19891 points

Hello Nicholas,

The LMZM23601 is a microSIP package with an LGA land pattern (no solder balls like in BGA). The pads on the device have ENIG finish. They can be soldered with SnPb or Lead free solder.

Cheers,
Denislav

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LMZM23601: Does this come or can we get this part in a leaded version for the balls (SN63 for example)? If not, is there any issue in re-balling this part with SN63?