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Trying to find thermal resistance values (junction-to-case) for three IT components

Other Parts Discussed in Thread: REG103

Hello,

I was looking for the thermal resistance values from junction-to-case for the following three parts:

UCC284DP-5
REG103GA-5
REG103-3.3

Please let me know if this informaiton is available.  Thank you.

Regards,

Carmelo

  • Hello Carmelo:

    For the UCC284DP-5, the junction-to-case thermal resistance (θjc) of the SOIC–8 DP package is 22°C/W. It is in the datasheet  Thermal Design section. 

    We don't have the junction-to-case thermal information for the REG103. But there is junction-to-ambien thermal resistance information for REG103 SOT223 package in the datasheet.

    Regards,

    Min