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TPS723-Q1: thermal dissipation in the Layout

Jessica Wu74
Expert 5970 points
Part Number: TPS723-Q1

Hello team,

I am designing a supply with TPS72301-Q1. It has 200mA output. I assume thermal dissipation needs to be taken care by increased area of PCB copper. To which pin I should connect those copper, GND, IN or OUT? Usually LDO has a thermal PAD for heat dissipation but it is existing in this LDO. Please advise. Thanks.

Jessica

  • 0
    TI__Mastermind 23361 points

    Hi Jessica, 

    Normally LDO datasheet contains a recommended layout example. For this device, as you can see here. You can have different copper to connect IN, OUT and GND as shown.

    Regards, 
    Jason Song

  • 0 in reply to Jason Song
    TI__Expert 5970 points

    Hi Jason,

    Got it. Thank you very much for your kindly support. 

    Best regards

    Jessica

  • 0 in reply to Jason Song
    TI__Expert 5970 points

    Hi Jason,

    Another short question about which pin is the main pin used for heat dissipation? Is Ground pin? Since i want to have copper in the back side of the board and not sure which pin's copper should i give the biggest area. Could you please kindly help to confirm that again? Thank you very much for your kindly support.

    Best regards

    Jessica

  • 0 in reply to Jessica Wu74
    TI__Mastermind 23361 points

    Hi Jessica, 

    For a package that does not have thermal pads, heat can be dissipated from all pins and this is the reason to maximize the copper areas each pin has access to. People normally have ground copper with the biggest area. 

    We have an application note on thermals and it has intensive coverage on the thermal performances using different layouts. Please use this one as your reference.

    Regards, 

    Jason Song