BQ24092: Exposed pad dimensions and board layouts

Daniel Flandin

Part Number: BQ24092

This part’s datasheet (http://www.ti.com/lit/ds/symlink/bq24095.pdf)., in pages 35 to 39 describes two different “Exposed Thermal Pad Dimensions” and corresponding examples of board layouts for the same part and package. Why are they different and which one should be used?

over 5 years ago

0 Bill Johns over 5 years ago

TI__Guru 68996 points

Hello

This device can be assembled with two lead frame options depending on availability and each lead frame has a different thermal pad dimension / board layout.

I will check on this a little more and update you late next week.

0 Bill Johns over 5 years ago in reply to Bill Johns

TI__Guru 68996 points

Hello

Some internal assembly files have been changed so that only the footprint on Page 39 will be used. This is what has been used for some time.

See below.

Will work on updating the drawing.

Power management

Power management forum

BQ24092: Exposed pad dimensions and board layouts