Hi ,
I would like to know the for the "Thermal resistance between Junction to Board -RθJB" part "CSD18511KCS".Also please let me know to calculate the power dissipation /formula of the same under normal operating conditions
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Hi ,
I would like to know the for the "Thermal resistance between Junction to Board -RθJB" part "CSD18511KCS".Also please let me know to calculate the power dissipation /formula of the same under normal operating conditions
Hello Vishal,
Thanks for the question. For the TO220 package, we do not specify thermal resistance from junction to board since this is a thru-hole part. The main path to remove the heat from the part is thru the tab on the back of the package. Are you asking for thermal resistance from junction to board thru the 3 leads of the device? Or, are you asking for thermal resistance from junction to board with the tab soldered to the PCB? If it is the latter, then you can use Rtheta(j-c) as specified in the datasheet. If it is thru the leads of the device, we don't have that data but I can look into it further. Please let me know.
Hello Vishal,
Following up to see if my previous message helped answer your questions. Thermal impedance is analog to electrical resistance where temperature is voltage and power dissipation is current. We have a pretty good blog on thermal impedance:
Hi Vishal,
Thanks again for your interest in TI MOSFETs. Since I have not heard back from you, I am assuming that all of your questions have been answered and will close this thread. Please feel free to reach out again if you have additional questions or need more information.