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CSD18511KCS: Thermal resistance between Junction to Board -RθJB required

Part Number: CSD18511KCS

Hi ,

I would like to know the for the "Thermal resistance between Junction to Board -RθJB" part "CSD18511KCS".Also please let me know to calculate the power dissipation /formula of the same under normal operating conditions

  • Hello Vishal,

    Thanks for the question. For the TO220 package, we do not specify thermal resistance from junction to board since this is a thru-hole part. The main path to remove the heat from the part is thru the tab on the back of the package. Are you asking for thermal resistance from junction to board thru the 3 leads of the device? Or, are you asking for thermal resistance from junction to board with the tab soldered to the PCB? If it is the latter, then you can use Rtheta(j-c) as specified in the datasheet. If it is thru the leads of the device, we don't have that data but I can look into it further. Please let me know.

  • Hello Vishal,

    Following up to see if my previous message helped answer your questions. Thermal impedance is analog to electrical resistance where temperature is voltage and power dissipation is current. We have a pretty good blog on thermal impedance:

    It’ s been a while since posting entries 1 through 5 in this series , but I find myself still fielding several questions about FET datasheets, particularly those parameters found in the thermal information…
    . Please let me know if you have additional questions. If I don't hear back in the next day, I will assume your questions have been answered and will close this thread.

  • Hi Vishal,

    Thanks again for your interest in TI MOSFETs. Since I have not heard back from you, I am assuming that all of your questions have been answered and will close this thread. Please feel free to reach out again if you have additional questions or need more information.