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LM337: Enquire on the process technologies node

Part Number: LM337
Other Parts Discussed in Thread: LM137

Dear Sir/Madam,

I would like to find out the different between LM337I and LM137

1) what is the process technologies node, eg same type of die design for both part. is using bipolar process technologies

2) I notice LM137 has space grade, does LM337I has space grade version? 

2) If both is the same process technologies, could I presume the space grade device has gone thru the additional screening like radiation tests and its package to qualify as space device? 

3) If both device is not the same process technologies node, what is the different, eg the process technologies for industry CMOS where else space grade is bicmos.

Tks

Regards,

Nick

  • Hi Nick, 

    We have received your questions, and we will try to get an answer to you by 10/21/2020. 

    Regards, 
    Jason Song

  • Hi Nick, 

    TI cannot share wafer, die and process details specific to any device, as this information is proprietary. Typically there are differences between space and non-space devices (including mil and EP grade products). These differences can be in the form of process, layout, or design changes. These are done to improve radiation performance of space device. Please note that radiation performance for a non-space device can be significantly worse compared to space qualified device even though electrical performance is identical. In addition there are several factors on non-space device that makes it risky for space applications. Some of important factors:

    -          No single controlled baseline: Translates to high variability of radiation performance (commercial products)

    -          Mostly use copper bond-wire: May not be reliable for space environment (commercial products)

    -          No testing for radiation at lot level: High risk of getting devices that have poor radiation level (non-space products)

    Regards, 
    Jason Song