Hi Team,
My Customer seems to have an issue with a recommended "land pattern" for the LM2990S-5.0, TO-263 package. They followed our datasheet unfortunatley they are getting calls from the assembly house that the footprint will not solder correctly or meet IPC Class 3 requirements. The dimensions of the lead pads (not the case pad) are too short and not spaced far enough from the case pad for proper fit. Do you have any idea on this?
Regards,
_renan