TLV733P-Q1: About Thermal pad of DRV Package

Koji Hayashi92

Mastermind 7030 points

Part Number: TLV733P-Q1

Hi TI-team

"Thermal pad" on the back of the IC is connected to the 3pin "GND" via the IC internal circuit.

Is it correct ?

Best Regards,

Koji Hayashi

over 5 years ago

0 JCHK over 5 years ago

TI__Guru 50190 points

Hi Hayashi-san,

The thermal pad is connected to GND as shown in the recommended layouts:

While this is connected to GND, the thermal pad is not a perfect GND in that there is some resistance between it and the IC GND. So it is essential that the GND pin of the device be used to connect to GND.

I hope this answers your question.

Regards,

0 Koji Hayashi92 over 5 years ago in reply to JCHK

Mastermind 7030 points

Hi JCHK-san

Thank you for quick response.

This figure.39 and 40 are not DRV.

Should I refer to Fig.26 of the data sheet ?

Best Regards,

Koji Hayashi

0 JCHK over 5 years ago in reply to Koji Hayashi92

TI__Guru 50190 points

HI Hayashi-san,

Yes. This is the layout reference for the DRV package:

I hope this answers your question.

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TLV733P-Q1: About Thermal pad of DRV Package