Hi TI-team
"Thermal pad" on the back of the IC is connected to the 3pin "GND" via the IC internal circuit.
Is it correct ?
Best Regards,
Koji Hayashi
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Hi TI-team
"Thermal pad" on the back of the IC is connected to the 3pin "GND" via the IC internal circuit.
Is it correct ?
Best Regards,
Koji Hayashi
Hi Hayashi-san,
The thermal pad is connected to GND as shown in the recommended layouts:
While this is connected to GND, the thermal pad is not a perfect GND in that there is some resistance between it and the IC GND. So it is essential that the GND pin of the device be used to connect to GND.
I hope this answers your question.
Regards,
Hi JCHK-san
Thank you for quick response.
This figure.39 and 40 are not DRV.
Should I refer to Fig.26 of the data sheet ?
Best Regards,
Koji Hayashi