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Do we have any information or data that compares the solder reliability of the QFN package device to a leaded alternative such as SOT23?
This is more of a general package question but this came up when comparing the TPS62140 to some alternatives in SOT packages. I have looked at the SMT package App Notes in the quality area of ti.com but don't see any comparison data.
Mark,
I don't know of any comparison report. I suppose you have read this:
www.ti.com/lit/an/slua271b/slua271b.pdf