TPS73115-EP: What is the difference between TPS73115-EP and TPS73115

Hey Eric,

The -EP versions of our devices are a higher grade of our devices.

Below is a list of some of the things -EP has over commercial grade devices:

• Using the latest and most robust plastic encapsulation methodology to support the harsh environment needs.

• Ensuring tin plating content is not above 97% to eliminate the risks related to time-dependent pin-to-pin metal shorts (aka tin whiskers) by assembling the device with NiPdAu plating or SnPb solder balls.

• Using only gold (Au) bond wires to ensure the highest quality die to leadframe connection.

• Performing extended 250 hours highly accelerated temperature and humidity stress testing (HAST) to demonstrate improved moisture resistance, extending both operational life and dormant storage capabilities.

• Extending temperature ranges from -55°C to 125°C to enable the broadest possible use cases.

• Ensuring a single controlled manufacturing baseline flow with a single wafer fab, assembly site and test site to ensure the applicability of customer’s qualification even over multi-decade programs.

• Ensuring orderable (V62/xxxx) DLA vendor items drawings part numbers that eliminate the need specification source controlled drawings.

Thanks,

Daniel