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TLV767: TLV767 temperature rising

Lenna Yan
Intellectual 1960 points
Part Number: TLV767

Hi Team,

The TLV767 package is very small and with a small thermal pad at the bottom. I want to know if you can share the temperature rising vs. current load curve.

  • 0
    TI__Genius 14245 points

    Hi Lenna,

    The temperature increase will be proportional to the load current since Tj=Ta+Rja*(Vin-Vou)*Iout. Unfortunately we can't give an exact temperature for your specific application since Rja is highly dependent on the board layout, but we can say that the increase in temperature will be proportional to the increase in current. 

    If you want to get a better understanding of how board layout can effect Rja, we recently released an app note which evaluated different layouts to see how they affected the Rja parameter. You can find that app note here: http://www.ti.com/lit/an/slvae85/slvae85.pdf

    Note that:

    • Tj=Junction temperature of the die
    • Ta= Ambient temperature of the board
    • Rja= Thermal resistance between the junction of the die and the ambient air

  • 0 in reply to Kyle Van Renterghem
    TI__Intellectual 1960 points

    Hi Kyle,

    Thanks for your quick reply. I know the calculation process. Do you have temperature increasing data based on the EVM?

  • 0 in reply to Lenna Yan
    TI__Genius 14245 points

    Hi Lenna,

    Unfortunately we don't have specific measurements made on this device, however our EVMs are optimized for thermals with very large amounts of metal and thermal vias connected to the device. We've found that our EVMs perform on par with the "thermally saturated" board shown in the app note I mentioned in my previous post which would result in an expected Rja which is ~54% of the JEDEC number listed in the PDS (Rja=41.8C/W).