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ISO5852S: Multiple PCB stackup giudance for ISO5852S gate driver

Part Number: ISO5852S

Dea sir,

we are using ISO5852S gate driver for our motor drive application. Due to space constrian, we wish to stackup the PCB as shown in the image below. 

Its recommended to not to have any tracks under the ISO5852s driver IC.

we are planning to have the power supply circuit in the bottom PCB and gate driver in the top board.

Could you please suggest the minimum requirerd hieght for placing ISO5852S driver. (not based on thte IC height. we required based on the consstraion of the iimage)..

Thanks & reagards,

Rajasekaran.

  • Hi, Rajasekaran,

    That is an interesting idea!

    Since you will be running power through the pins from board to board, make sure you put some bulk decoupling on the board near the ISO5852S driver. These bulk caps will probably be the tallest components to set your z-height.

    You might want to review this EVM design. Since you will have the power supplies on a different board, the transformers won't be necessary on the board with ISO5852S.

    https://www.ti.com/lit/ug/sllu298/sllu298.pdf

    Let us know if you have further questions.

  • Dear sir,

    Thanks for your guidance. 

    In our design, already we are using 47uF / 50V  electrolytic capacitor nearer to ISO5852S pins. Is it sufficient to supply current to the driver or do we need to increase the capacitor values? 

    Thanks & regards,

    Rajasekaran.

  • Hello Rajesekaran,

    I can help you to determine an estimation for the capacitance based on the driving parameters including:

    - Capacitive load of switch you are driving (Cg).

    - Switching frequency (fsw).

    - Drive voltage (VCC2, VEE2).

    - Gate current (Ig, which is (VCC2-VEE2)/Rg).

    - Allowable tolerance of VCC2.

    Regards,

    Audrey