This circuit attached is conducting 100MHz noise back onto the power input line. Attached is the circuit and the radiated EMC trace.
676750 Rev C_Logic0.pdf
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This circuit attached is conducting 100MHz noise back onto the power input line. Attached is the circuit and the radiated EMC trace.
676750 Rev C_Logic0.pdf
Do you have L2 populated? If you remove L2 does the 100MHz noise get higher in amplitude? Proper ferrite bead selection must be done to attenuate HF noise.
Additionally, placing a low value cap, 220n to 470n close to the VIN pin of the device should help attenuate noise.
Lastly, this noise does not necessarily have to be conducted. It may be radiated. Reducing SW node area, including, physcial size of inductor will reduce radiated noise.
Thanks for the reply.
Yes, L2 is populated and was added to cut down on the conducted noise back onto the power line. I have tried other values but none seem to effect this high frequency noise on the power line. I will bypass it tomorrow to see the effect.
I will also try a 470nF on the Vin pin.
I will need to look to see if / how the SW node could be smaller.
I also tried a snubber across D13 which seemed to make it worse. A 150pF across R87 with no effect, and various caps around L2 with no effect.
I did add a 10 Ohm resistor in series with the BOOT cap C54 which helped greatly, but caused chip overheating.
You can try reducing RBOOT value to avoid higher switching loss.
Please let me know how your experiments go.
I jumped across L2 with a slight increase in noise.
I replaced L2 with a 10 uH inductor with no change.
I added a bypass cap on the chip leads from Vin to GND with no change.
I added a capacitor bank of 10uF II .1uF II .01uF - with no change
I used a .01uF in series with 47 Ohms with only minor change
Nothing is working so far.
Thanks for the experiment.
It sounds so far like the only thing that is helping is slowing down rise time of the HS FET turn-on to limit SW node ringing.
In addition to slow down the turn on with a lower value rboot resistor to avoid inefficiency, you could try and reduce the inductor physical size in case it is coupling back to input wires.
Lastly, make sure your high frequency caps are placed close to the IC to minimize high frequency loop inductance.
I have tried all of the suggestions and nothing is working - I have run out of things to try. When I chose this part I thought that is would be an easy solution.
Does TI offer any other part in the same 8SOIC package and pin-out? Are there other automotive rated parts with low size, 8SOIC package that would not have these noise issues?
The board redesign and retesting is really going to cause great problems.
Sorry for the issues. EMI can be challenging.
Hotrod package devices allow for simple design with little-worry for EMI.
Please see: http://www.ti.com/lit/ds/symlink/lmr33620-q1.pdf