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LMG1205: LMG1205 dsBGA Ball Diameter

SimonR
Prodigy 30 points
Part Number: LMG1205

Hi,

We have been having issues where we suspect there is arcing across from the HS ball to the VDD ball. There is visiable damage to HS, VDD, LOL, LOH and GND balls. We are supplying VIN to the drain of the highside GaN FET with 85V.

Looking at the solder ball side profile with a microscope, we estimate the diameter of the solder balls to be around 310um.

Does TI provide any recommendations for what the finished diameter of the solder balls should be on the dsBGA packages?



  • 0
    TI__Genius 12990 points

    HI Simon,

    Thanks for reaching out about LMG1205.

    Is there damage to the FETs? or is the driver just burning?

    do you have working waveforms during normal operation of VDD, HS and LO?

    what application is this? do you have sch and layout for review?

    1205 has a ball diameter ranging between 250um and 280um. This info is on page 23 of the LMG1205 datasheet ()

    It could be possible that the balls melted to a larger diameter under the high heat.

    Also, Check out this DSBGA app note let me know if you have any questions ()

    Thanks,