TI_ each chip solution, board file want to add test point for ICT

Hello chan,

  What TI devices are used on the pcb?  In general, there are layout recommendations for many product families, and some general layout App Notes, such as this one: http://www.ti.com/lit/an/scaa082a/scaa082a.pdf  .  

You should also inquire with the InCircuitTest manufacturer concerning ESD suppression techniques as the pcb comes in contact with the ICT.  Refer to each device datasheet for ESD ratings, and in general, proper ESD control techniques will prevent the buildup of ESD.  Useful information is in this App Note: http://www.ti.com/lit/an/szza047/szza047.pdf .

Regards,

~Leonard  

Hi, Leonard

I’m worry added test point trace is too close to the adjacent trace.

Originally, the two traces were 10 mils wide and the distance between them was 40 mils. After adding the test points (20 mils), there is 30 mils left. Is there any hidden worry about the reduced distance?

Hi chan,

What are the devices involved and the operating speed of the signals?  In general, I don't think this is an issue, and one suggestion to increase the distance between the TPs is to shift the TP up (or down) the trace 20mil so they are not directly opposite from each other.  This will give 35mil between the TP and the adjacent trace. 

~Leonard 

Hi chan,

  Seems the info I provided earlier resolves this inquiry and hoping this was helpful to your design efforts.  Please let us know if you have any further questions. 

Regards, 

~Leonard