Hello,
My customer has an experience that one of our eFuse didn’t go shutdown enough fast because the board’s thermal performance was too good.
At the time, they modified the board to float thermal pad to improve shutdown time.
Now they are designing a new board with TPS2596 and are considering to the same thing, floating thermal pad.
Then they are asking me what TI think for this way.
What do you think about floating thermal pad to improve shutdown time?
Is this way acceptable?
Regards,
Oba