Hi team,
How should we design the PCB layout for TPSM265R1 in the inverting buck boost topology(VIN=24, VOUT=-15V/IOUT<50mA), especially heatsinking?
Best regards,
Iwata Etsuji
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Hi team,
How should we design the PCB layout for TPSM265R1 in the inverting buck boost topology(VIN=24, VOUT=-15V/IOUT<50mA), especially heatsinking?
Best regards,
Iwata Etsuji
Hi,
We will have the corresponding AE to reply you next week because US is in holiday.
Hi,
Please follow the same PCB layout recommendations in Section 10.1. Note that when converting from buck to inverting buck boost topology, the IC return path is now -VOUT and the IC output pin is now GND as shown in the following app note (SNVA882). VIN, - VOUT and GND copper planes should be large to minimize thermal stress.
Regards,
Jimmy