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TPS84259: Junction to Board Thermal Resistance

high speed guy
Expert 3505 points
Part Number: TPS84259

Hi,

I need to know the junction to board (bottom) thermal resistance for this device.  I see on page 4 of the data sheet lists "junction to board characterization parameter" however I need to understand the value for the actual thermal resistance.  Can you provide it?

Thank you,
HSG 

  • 0
    TI__Guru 50120 points

    Hi HSG,

    I will look for this and try to get back to you within a day or two with the answer.

    For now what I can say is that I think the SOA temperature derating curves in the datasheet would provide more meaningful evaluation as these dataset measurement takes into account all of the components on the module that could be the bottleneck in thermal design. 

    Regards,

    Jimmy

  • 0 in reply to Jimmy Hua
    TI__Guru 50120 points

    Hi HSG,

    TI does not have the actual thermal resistance values. Please use the characterization parameter or refer to the SOA temperature derating curves for your thermal design. The SOA temperature curve is actual lab data measured using the EVM at certain input, output and load conditions which will give you a realistic interpretation of the thermal performance the device can provide. 

    Regards,

    Jimmy