LMR33630-Q1: AEC-Q006 spec

Patrick Chen(TPE System & Application)

Part Number: LMR33630-Q1

Hi Sir,

The of LMR33630-Q1 is connected by copper pillar bump between die and lead frame.

My customer is asking that if the bonding wire is Copper, there is another automotive certification AEC-Q006 that the chip should pass.

May I know if a chip like LMR33630-Q1 need to pass AEC-Q006 certification?

Did LMR33630-Q1 pass AEC-Q006 certification?

Many thanks,

Patrick

over 5 years ago

0 Frank De Stasi over 5 years ago

TI__Guru 72525 points

I will ask the product engineer for this device and get back to you by the end of this week.

0 Allan Webber over 5 years ago

TI__Intellectual 1670 points

I am the reliability engineer supporting the LMR33630-Q1 product line. Just to add some clarification in case the term copper pillar' is not understood.

The scope of AEC-Q006 is for the qualification of a copper wire technology.

The LMR33630-Q1 device does not use copper wire to connect the silicon to the package leadframe. Instead, it's package assembly is with a flipchip solder connection from the silicon to the leadframe so AEC-Q006 does not apply to LMR33630-Q1.

0 Patrick Chen(TPE System & Application) over 5 years ago in reply to Allan Webber

TI__Expert 3430 points

Hi Allen,

Many thanks, So all the Hodrod package do not nee to test AEC-Q006 right?

Patrick

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LMR33630-Q1: AEC-Q006 spec