This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LM5175-Q1: What kind of trouble will occur if the thermal pad is not connected to analog GND?

Part Number: LM5175-Q1

I have a question about PowerPAD of LM5175QPWPTQ1.
As shown below (attached), it is supposed to be connected to analog GND as shown in the data sheet.
What kind of trouble will occur if you do not connect?

As for the situation, it was energized with PowerPAD floating when repaired
I am concerned that it is operating without problems and cannot be detected as a mounting failure.

I hope this case doesn't cause the destruction of the IC.

Best regards

  • Hi,

    Thank you for using the LM5175-Q1.  The datasheet recommend to solder the device to the underpad. If you haven't, the circuit may still function but we cannot guarantee the performance.   If you follow the standard reflow procedure, you should not have problem in getting a successful soldering.

    Anyway, please make sure that you always follow the datasheet recommendations when using the IC. 

    Thanks,

    Youhao Xi, Applications Engineering