Hello!
I have a question regarding how to properly ground the DFN HotRod package of the 63802.
In the datasheet, it states, "Separate AGND and PGND. Do not connect AGND and PGND directly at the IC. See Figure 44 as an example."
However in figure 44, and as far as I can tell in the layouts of the EVM, PGND and AGND are indeed directly connected to one another.
So, what grounding technique works best? Connect AGND and PGND directly as shown in examples, or totally separate the two and join the the Ground layer with vias a bit distant to the 63802?