Team,
My customer has the following question:
We are planning to use your TPS82130 device but are struggling with thermal analysis margins.
There may to be an error on the datasheet (Table 6.4, Page 4), the junction-to-board thermal resistance (14.4 °C/W) is quoted as being less than the junction-to-case (bottom) thermal resistance (21.1°C/W), and I cannot understand why; the thermal resistance from the junction to the board must be greater than the thermal resistance from the junction to the bottom of the case.
Is there a mistake on the datasheet, if so what are the correct values?
Regards,
Aaron
