This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LP2998: LP2998MRX/NOPB-- Baking details

Part Number: LP2998

Dear Team,

 

We are using TI DDR terminator with having P/N# LP2998MRX/NOPB in one of our project with JPN# BA000000000177R.

We need Baking conditions for the above TI P/N#LP2998MRX/NOPB.  We are requesting with you to kindly help on this case,

Thanks & Regards,
Hemantha 

  • Hello, 

    In general please refer to "JSTD033B01" Standard.

    In the standard you will find "Table 4-1". This contains the "Reference Conditions for Drying Mounted" or "Un-mounted SMD Packages".

    Considering LP2998MRX/NOPB body thicknesses is 1.7mm, and humidity level is 3, the baking condition 27 hours at 125c is recommended. 

    Thanks

    Qian