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TPS54320: TPS54320:condition of solder connection of thermal pad to signal ground

user5006534
Prodigy 90 points
Part Number: TPS54320

Hi team.

I have a question about mounting evaluation.

Is there the recomended condition of solder connection of thermal pad to signal ground ?
What is the percent of the recomended condition of solder connection?

  • 0
    TI__Expert 4035 points

    Hi,

    The GND pin should be tied directly to the exposed thermal pad under the IC. Please refer to the datasheet layout example. From thermal performance side, the bigger connection area, the better thermal performance. No absolute value for the percentage of solder connection.