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CSD13383F4: CSD13383F4: cold joint in manufacture

Zhanpeng Li
Intellectual 2140 points
Part Number: CSD13383F4

Hi Team,

One of my customer is facing the challenge in cold join.


At first, pads designed according to the manufacturer's recommendation.However, tin beads and cold joint problems occurs after the patch.

then change the design as follow:


and still have problem in cold joint after a number of steel mesh optimization in SMT plant.

 

Can you give us some suggestion in this case?

How can we solve this problem?

  • 0
    TI__Mastermind 34275 points

    Hi Brandon,

    Thanks for the inquiry. I checked with one of our SMT experts. Their feedback is given below. We need to do a more detailed review of the customer's pad and stencil design. Would it be possible to get the gerber files from the customer. Also, we need to know what solder paste they are using and their reflow profile. You can contact me directly on my TI.com email with this information.

    From SMT Expert:

    We have to be aware that changing the pad designs could lead to shorting and tilting of the device.

    TI optimized the pad and stencil openings including stencil thickness as well as the type of paste to be used as per Apps notes.

    The cold solder joint is a reflow and solder type factors…not the pad opening.

    Please refer to the FemtoFET mounting for more detailed information.

  • 0 in reply to John Wallace1
    TI__Mastermind 34275 points

    Hi Brandon,

    Following up to see if this has resolved the issue or if you have additional questions. I'll wait another day for your response. If not, I will close out this thread.

  • 0 in reply to John Wallace1
    TI__Mastermind 34275 points

    HI Brandon,

    Thanks again for promoting TI FETs at your customer. I am going to close out this thread. Please contact me via regular email after Chinese New Year if you have additional questions.

  • 0 in reply to John Wallace1
    TI__Intellectual 2140 points

    Hi  John,

    Thank you for helping. i will contact with you through email directly.

    BR.