TLV62568A: Design consideration - low dropout vs. bridging IN/OUT

Hello,
I need to tune PA output of a SKY FEM. This is unfortunately only possible by tuning VCC-TX of that chip, no chance to do it via PA_IN or even VPC (I had a long conversation with Sky about it).

This chip is currently (its a given design, in production) sourced by 3.3V - which is neccessary for max PA output. To achieve lower output I need to reduce VCC_TX, e.g. in 4 steps between 1.5 - 3.3 V. My plan is to to vary R2 between certain values, using solder bridged parallel resistors.

Now 3.3V is the main supply voltage: I can't afford any dropout voltage from the buck.
Question: is that chip able to pass through VIN to VOUT without droput loss?
Or, if not, can I bridge VIN with VOUT via an additional solder bridge in case of 'full PA' without damaging something?

Same question would be if I use this design (would prefere it - no coil, no EMI - but here I know that there is 0.2V voltage loss):

Thanks!