LP2951-Q1: How to connect the thermal pad?

Steve Fenwick

Part Number: LP2951-Q1

The DRG package for this part shows a thermal pad, but the datasheet doesn't specify whether to leave it floating or tie it to GND. Please clarify how it should be tied.

over 5 years ago

0 Jason Song over 5 years ago

TI__Mastermind 23361 points

Hi Steve,

We normally recommend grounding thermal pad for better heat dissipation. I don't see a reason why this device should be different.

Regards,
Jason Song

0 Steve Fenwick over 5 years ago in reply to Jason Song

Prodigy 40 points

I agree. I thought it odd that TI would not provide specific instructions, as TI usually does.

Thanks!

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LP2951-Q1: How to connect the thermal pad?