LMZM33606: What is the surface roughness

Damiano Balzani

Prodigy 200 points

Part Number: LMZM33606

Dear all,

In my design, i need to put on the top surface of LMZM33606 a thermal pad to improve the thermal exchange.

my question is: what is the roughness of the top surface?

Thanks in advance

Best regards

over 5 years ago

0 Jimmy Hua over 5 years ago

TI__Guru 50120 points

Hi Damiano,

Are you planning on using thermal paste and an external heat sink to help remove heat from the package?

I will get back to you on the roughness/ contact resistance after talking with the product engineer who helped define this part.

Regards,

Jimmy

0 Damiano Balzani over 5 years ago in reply to Jimmy Hua

Prodigy 200 points

Hi Jimmy,
Yes, i'm planning on using a thermal pad and an external heat sink to helop to remove heat from the package.

Do you have any alternative advice?

Regards,

Damiano

0 Jimmy Hua over 5 years ago in reply to Damiano Balzani

TI__Guru 50120 points

Hi Damiano,

I've talked to the product reliability expert and unfortunately the contact resistance/ roughness has never been characterized. However I can say that I have had customers used the TI power modules with heat sinks without issue, or at least not reported.

Do you have any other questions about the LMZM33606 power module? If you need help with schematic and layout review, feel free to provide it here so I can help in any way possible.

Regards,

Jimmy

0 Damiano Balzani over 5 years ago in reply to Jimmy Hua

Prodigy 200 points

Hi Jimmy,
Thanks for your work

in case of doubt i will contact you

Regards

0 Efraim Brandolini over 5 years ago in reply to Jimmy Hua

Prodigy 50 points

Hi Jimmy,

following the discussion on removing the heat from the package, can you tell me what's the compression resistance of this device once mounted on a PCB?

Because I'm going to use a thernmal pad on the top of the LMZM33606 to remove heat. The pad I think is suitable for my purposes requires mounting pressures between 10 and 40 PSI in order to reach good performances. This means that I will compress the power module with a force between 12 and 45 N. Can you tell me if this would damage it?

Thanks and kind regards,

Efrai Brandolini

0 Jimmy Hua over 5 years ago in reply to Efraim Brandolini

TI__Guru 50120 points

Hi Efraim,

I see you created another thread with the same question as your previous reply.

In order to consolidate the troubleshooting effort, I'll close this thread and reply to your latest thread.

Regards,

Jimmy

0 Efraim Brandolini over 5 years ago in reply to Jimmy Hua

Prodigy 50 points

Thanks Jimmy,

have a holy Easter.

Efraim

0 Jimmy Hua over 5 years ago in reply to Efraim Brandolini

TI__Guru 50120 points

Have a holy Easter to you too.

Jimmy

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LMZM33606: What is the surface roughness