Normally thermal resistance JA is higher than JC. In TPS7A25, JA is 73 while JC is 90. Any specific reason for this behavior ? Also, could you please help to confirm same ?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Normally thermal resistance JA is higher than JC. In TPS7A25, JA is 73 while JC is 90. Any specific reason for this behavior ? Also, could you please help to confirm same ?
Hi Prahlad,
We show two JC numbers as shown below:
RTJC(TOP) is from the die to the top of the package through the mold-compound. RTJC(BOT) is from the die to the packages power pad. Here is an illustraion of the different parameters:
This is showing how the paths for heat to escape the package relate to RTJA.
The fundamental reason for the higher number is we have a smaller die, which means a smaller surface area to spread the heat.
I hope this helps to answer your question.