TPS53319: About metal mask information

Tsukui Yusuke

Guru 21930 points

Part Number: TPS53319

Hi,

Could you tell me about the metal mask for mounting?

Is there an ideal aperture ratio for a metal mask opening relative to a pad?
Or Is there a target value (xx％) for the bonding ratio between the thermal electrode and the pad on the board?

Best regards,
Yusuke

over 5 years ago

0 Peter James Miller over 5 years ago

TI__Guru 56765 points

You included the mechanical drawing for the recommended solder stencil in your post. This is on page 37 of the datasheet

http://www.ti.com/lit/ds/symlink/tps53319.pdf#page=37

The recommended stencil opening for the thermal pad is 6 1.4mm x 1.4mm opennings in a 2 x 3 array with 0.3mm spacing. This provides enough soldier for approximately 62% coverage post reflow and improves the solder distribution.

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TPS53319: About metal mask information