Hello all,
Could you give me any comments about the buck double layout, please?
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Hello all,
Could you give me any comments about the buck double layout, please?
Hi Garam,
Edit: The layer 2 GND should be solid pour over the IC EP vias for thermal spreading.
I would suggest following the layout example in Figure 34 (pg28) of the LMR23630 datasheet.
Let me know if you have questions,
-Orlando