This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Buck Converter Schematic and Layout

Other Parts Discussed in Thread: LMR23630

Hello all,

Could you give me any comments about the buck double layout, please?

  • Hi Garam,

    • The LMR23630 AGND (pin6) should connect to the same GND pour as the EP, right now they are disconnected.
    • We recommended routing the VOUT trace to the feedback resistors on the same layer no vias.
      • Vias introduce undesirable parasitic inductance to the output voltage feedback loop.

      Edit: The layer 2 GND should be solid pour over the IC EP vias for thermal spreading.

      • Right now the vias under the IC do not connect to layer 2 copper, so they cannot spread heat through the board and the IC will be warmer. Even the other GND vias near CIN are not connected to layer 2 GND.

    I would suggest following the layout example in Figure 34 (pg28) of the LMR23630 datasheet. 

    Let me know if you have questions,

    -Orlando