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BQ25616: Thermal aspects

Gopi K
Prodigy 120 points
Part Number: BQ25616

Hi,

We are planning to using BQ25616 in our new design. The board is in design phase. We are using 70mmX22mm 4 layer PCB. On which we have One full GND layer. We are connecting the exposed pad to inner GND plane. Please let us know whether we need to take any more precautions to avoid any thermal issues later? Our design supports 3A current.

  • 0
    TI__Expert 5590 points

    Hi, we have layout guidance in BQ25616 datasheet. Thermal wise, considering 3A current, I do not recommend blind vias under the IC thermal pad. The vias under the thermal pad should be through all the way down  to the bottom layer. It would be better if the bottom layer is GND layer. If not, please enough GND copper area around the vias from the IC thermal pad. Thanks.