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TPS56637: Acceptable minimum solder joint area (%) for Vin, SW and PGND

Takashi Onawa
Genius 13200 points
Part Number: TPS56637

Hi team,

Could you tell me required minimum solder joint areas(%) for Vin(pin8), SW(pin6) and PGND(pin9) of TPS56637?

I'm understanding 50% is required for the device having thermal pad but HR pkg product's requirement on the point is unclear for me.

Regards,

Takashi Onawa

  • 0
    TI__Mastermind 18510 points

    Takashi-san,

    Why do you ask this? As I know Hotrod QFN thermal pad area solder coverage is recommended >50% for Theta JA effect. (Package Thermal Resistance Values ), 

    But as you know, VIN/SW/PGND are power pins which need to carry high current, I have no data to for the performance evaluation with different solder coverage. so better to be totally covered.

    Yuchang

  • 0 in reply to Yuchang Zhang
    TI__Genius 13200 points

    Hi Yuchang-san,

    My customer can not be sure covering full connection in assy process according to their past experience.
    So they need to indicate minimum coverage to assy engineer and estimate the yield from some assy test.

    The information is needed for reflow conditions and solder mask optimization.

     

    Regards,

    Takashi Onawa

  • 0 in reply to Takashi Onawa
    TI__Mastermind 18510 points

    Hi Takashi-san,

    As I mentioned, I got the data is >50% for Rthja considering, but should no data to evaluate about the performance related.

    Yuchang