Other Parts Discussed in Thread: TPS22920,
I am using the TPS22920 load switch part in a design of mine. That switch is difficult to solder, and seems prone to damage due to reverse current from Vout > Vin on shutdwon. So I decided to replace it with the TPS22990 load switch, and I have some questions:
1) I want to keep the rise time as close as possible between the two designs. I find myself using values of between 33nF-47nF for the CT part. So I assume that a long rise time could affect the thermal aspect of the TPS22990, since the internal FET has an SOA that needs to be respected.
How would I go about determining if this is an issue?
2) Regarding reverse current due to body diode, I see that the TPS22990 does not have an absolute maximum rating which states that that Vout <= Vin.
So does that mean that it is less susceptible to reverse current through the body diode? (I only need to verify the current in a power shutdown condition.)
How much current can the body diode take before damage?
Do I need to add extra bleeders in order to mitigate this issue?
Can I use the PG pin to bleed, and if so what is the maximum current that it can sink?