Hello TI Team,
We are developing a thermal validation vehicle. We do not expect the board to be functional. The goal is to replicate the power dissipation of the main ingredients of the production board. To do so we are applying reversed bias connection to some devices like voltage regulators, so the body diode of the FET generates heat.
We would like to do the same to the by applying power to the TPS259261 by:
- Applying 12V to OUT pins (8,7,6) and GND (Thermal Pad -11)
- Apply Ground to VIN pins (5,4,3)
We would be using a controlled power supply to limit the current so we just to generate the expected power per our thermal simulations.
- Do you think is this doable?
- Are these the right pins to be connected, is there any other pin termination we should take into account?
Thanks in advance
-Eduardo
