LM5106: Ball composition

Kota Morihara

Part Number: LM5106

Our customer asked the following question to register a device that uses Sn, but this URL (www.ti.com/.../search did not contain the answer to the question.
Could you tell me the details?

Material: LM5106MMX/NOPB

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

Your prompt support would be highly appreciated, thank you!

over 5 years ago

0 Richard Herring over 5 years ago

TI__Mastermind 23215 points

Hello Kota,

For the details on the device leads material, I will have to research these questions and get back to you. Can you comment if the customer has special requirements?

Regards,

0 Richard Herring over 5 years ago in reply to Richard Herring

TI__Mastermind 23215 points

Hello Kota,

I received feedback about the LM5106 package material. Answers are below.

Material: LM5106MMX/NOPB

1. Use Ni for grounding or not. : Yes / No

No, no Ni in leadframe

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

Sn plating spec is 7-20um

3. Heat treatment such as annealing or not : Yes / No

Yes

Confirm if this addresses your questions, or your can post additional questions on this thread.

Regards,

Power management

Power management forum

LM5106: Ball composition