• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 62 subscribers
  • Views 174 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Original question:

TPS50601A-SP: Does TPS50601 have floating metal lid or is it grounded

TPS50601-SP: Thermal Isolation Pad and package / metal lid

Alpha H
Genius 10855 points
Part Number: TPS50601-SP

Hi Space team, 

I have a question regarding the TPS50601-SP (non-A version).

Can you guys confirm two aspects of the package:

  1. The thermal pad needs to be connected externally to PGND? I see footnote #1: "Thermal pad (analog ground) must be connected to PGND external to the package."
  2. Is the package / metal lid grounded? I see an E2E post saying the "A" version package is GND'ed, but is also the non-A version?

https://e2e.ti.com/support/power-management/f/196/t/784907?tisearch=e2e-quicksearch&keymatch=TPS50601A-SP%20metal%20lid

Cheers, 

AH

  • 0
    TI__Genius 14540 points

    The metal lid, the thermal pad, and pin 1, GND, are all connected internal to the device; therefore, the metal lid will be grounded.  Pin 1, GND, should be connected to PGND external to the device on the PCB.  Since pin 1 GND and the thermal pad are connected internally, this external connection to PGND can come through pin 1 GND only (i.e. leaving thermal pad footprint on the PCB electrically floating), or through thermal pad and pin 1 GND tied to same PGND PCB plane. 

    Thanks

    Christian