For TPS65023, there are several kinds of Ground: (1)thermal power pad(2)AGND1,AGND2(3)PGND1,PGND2,PGND3(4)input and output capacitor Ground.
I recommend the following layout,do you have other recommendation?
(1)For the whole board,there will have one layer Ground plane
(2) thermal power pad is connected to Ground plane by vias
(3) DCDC1 input and output capacitor Ground is connected to PGND1 firstly, then is connected to Ground plane by vias
(4) DCDC2 input and output capacitor Ground is connected to PGND2 firstly, then is connected to Ground plane by vias
(5) DCDC3 input and output capacitor Ground is connected to PGND3 firstly, then is connected to Ground plane by vias
(6) AGND1 is connected peripheral signal ground,then is connected to Ground plane by vias
(7)AGND2 is connected peripheral signal ground,then is connected to Ground plane by vias