customer want to know what's the RθJC(bot) of DCK (SC70)?
in datasheet, it is N/A.
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RθJC(bot) is not provided for packages without a thermal pad. Meaning increasing the Copper pour under packages without a thermal pad as a very marginal impact on thermal performance.,
We have this for packages like the WSON as this does have a thermal pad and the amount of copper under the package has a significant impact on thermal performance. The numbers in the chart above are based on a JEDEC standard high-K PCB. This is not an ideal layout as shown in the following application report.
I hope this helps to clarify.