Hi Team,
could you please help me understand which pins of LM61460 will be the ones heating up the most?
Regards
Andreas
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Andreas,
PGND, VIN, and SW have a higher thermal conductivity from the die to the pad but PGND should be prioritized when designing the layout with large amounts of copper to spread the heat. SW is noisy so large copper area will result in poor EMI performance and noise coupling to nearby circuits. VIN is less noisy but still contains the SW ring from the edge of the SW rise. This can also cause poor EMI if this copper is large but is not as critical as SW.
All other pins can also be used to spread the heat. AGND, BIAS, PGOOD, and RT are the best low-noise less-sensitive pins which can be used to spread the heat.
-Sam