TLV758P: Thermal Via for Pad Location (DRV Package)

Hi Team,

The TLV758P in section 10.1 says, "Do not place a thermal via directly beneath the thermal pad of the DRV package. A via can wick solder or solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder joint on the thermal pad."

However, the image in section 10.2 appears to have 5 vias under the thermal pad. 

Should we put thermal vias directly beneath the pad or right outside the pad on both sides of the package?

Thank you,

TR