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TPS7A7002: with use stencil thickness of 0.1mm,Power pad geometry

minami
Prodigy 50 points
Part Number: TPS7A7002


I'm considering　TPS7A7002 PCB board layout.(TPS7A7002.pdf P21)

With use stencil thickness of 0.1mm,Power pad solder Stencil Opening is 3.3mm(X)×2.6mm(Y)

On the other hand,Power pad geometry is 3.1mm(X)×2.4mm(Y)

Is it means  a Part of solder Over Solder Resist and　when conpornent mounting,these solder get together Power pad geometry? 

TPS7A7002.pdf

  • 0
    TI__Mastermind 44790 points

    HI,  

    I found the following app note which recommends a stencil opening based on a .127mm stencil thickness. Other recommendations and can find seem to recommend a stencil thickness of 4-5mils (0.1016-0.127mm).

    It seems 0.100mm might be marginal. If the thermal pad is not properly soldered to the board, it may experience thermal shutdown earlier than expected.

    I hope this helps answer your question. 

  • 0 in reply to JCHK
    Prodigy 50 points

    Thank you for your answer.

    I understand thickness of 0.1mm is marginal .

    But I want to use this compornent on 0.1mm thickness,and Datasheet recommended Power pad solder Stencil Opening is 3.3mm(X)×2.6mm(Y)

    In this Case,What is the size of Power pad geometry ?

    I made a diagram to convey the question accurately. Please confirm.padsize.pdf

  • 0 in reply to JCHK
    Prodigy 50 points

    Hello ,It's been a week since I responded, but what about the situation?

    Thank you