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LMZM23601: Condition of Baking LMZM23601

Shinichi Inoue
Guru 21566 points
Part Number: LMZM23601

Dear Specialists,

My customer is using LMZM23601 and has a question.

I would be grateful if you could advise.

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We have the LMZM23601 in stock.
168 hours of floor life have passed since opening.

We are thinking of baking, so please let us know which conditions of IPC-JEDEC J-STD-033 should be applied.
And which provisions in the attachment (SNOA550G) should be applied?

If the standards are different because the LMZM23601 is a module, please let me know the applicable standards and conditions.

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We appreciate your great help in advance.

Best regards,

Shinichi

  • 0
    TI__Guru 50120 points

    Hi Shinichi,

    Yes you can use that application report as reference for baking the device. 

    The LMZM23601 is a MSL3 device so please follow Table 5 level 3 for thickness >1.4mm <2.0mm.

    Generally I've had customers bake the part at 125C for at least one full day.

    Regards,

    Jimmy

  • 0 in reply to Jimmy Hua
    Guru 21566 points

    Hi Jimmy,

    Thank you for your reply.

    I understand LMZM23601 should be followed Table 5 level 3 for thickness>1.4mm <2.0mm.

    I'll share this information with the customer.

    I appreciate yourgreat help and cooperation.

    Best regards,

    Shinichi