Dear Specialisth,
My customer is encountering LMZM23601's low efficiency and overheating.
I would be grateful if you could advise.
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Regarding the board using LMZM23601V5SIL, the problem that efficiency becomes poor and temperature rises occurs on multiple boards.
Could you please let us know what's wrong and what makes it less efficient and overheating?
* The board has been confirmed by X-ray image that the Thermal Pad of the abnormal board is soldered.
*Even if the power of the abnormal board is turned on while continuing to cool the abnormal board with a cooling agent to about -10°C, the operation of the abnormal board will not change.
(There is no Thermal Pad VIA described in the data sheet, but we think that it is not a heat dissipation problem because the problematic operation occurs even if it is cooled.)
・Abnormal board
VCC 33V, Iin 107mA, Win 3.5W → VOUT 5V, Iout 54mA, Wout 0.27W: Efficiency 8%, LMZM package surface 47°C
VCC 33V, Iin 319mA, Win 10.5W → VOUT 5V, Iout 314mA, Wout 1.57W: Efficiency 15%, LMZM surface 200°C
(The temperature rises immediately after the power is turned on. Then ON: 100ms, OFF: 300ms are repeated)
・Normal board
VCC 33V, Iin 68mA, Win 2.25W → VOUT 5V, Iout 418mA, Wout 2.09W: Efficiency 93%, LMZM surface 53℃
・Schematic and image (same for abnormal and normal boards)
VCC=33V
Is there a possibility of unexpected connection with adjacent pin, GND or VCC.
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I appreciate your great help in advance.
Best regards,
Shinichi