TPS77601-EP: Thermal resistance

Also, our customer would like to know if the thermal resistance of this device has been analyzed through finite element analysis or tested thermally in a vacuum chamber to see the resistance without an air gap? They're concern that it includes dissipation to ambient air and dissipation through an air gap to the board.

Hi Carlo,

The junction-to-lead or junction-to-board thermal resistances for this part are not readily available, but if it is any help the junction-to-ambient thermal resistance is on page 16 of the PDS where it also explains how to use the part with given ambient conditions. 

If this is not satisfactory for the customer, I have put in a request for a thermal analysis of this part, which will take 1-2 weeks. 

Regards,

Nick Butts

Hello Nick,

Thank you for looking into this. Our customer needs the theta JB, I will inform them of the request lead time.

Regards,
Carlo

Hi Carlo, 

All of our datasheet thermal data is analyzed using CFD (computational fluid dynamics) simulation tools. It captures the details of the package and PCB, as well as natural convection airflow around the assemblies. As such, the simulations do include dissipation through the ambient air.

Does the customer need the thermal resistance in a vacuum? I am not sure if we can get a measurement like that but I can certainly ask.

Regards,

Nick

Hello Nick,

Good day.

If we can provide the thermal resistance tested in both conventional ways and analyzed in a vacuum, it would be great.

Thank you.

Regards,
Carlo

Hi Nick,

Good day.

Thank you for this information, your help is appreciated. There is no need to proceed in acquiring a vacuum chamber lab measurements.

Regards,
Carlo