Other Parts Discussed in Thread: UCC21750, UCC21732
Hi expert,
I would like ask two questions about the active miller clamping (AMC) function of ucc21750. According to D/S, ucc21750 provides the internal miller clamping pin (CLMPI).
Questions are as follows.
1. If extra BJT-CB (>10A) is required for SiC mosfets, where to connect CMLPI pin? I found there maybe a website link about this question in E2E, but it is not available anymore. Could you please explain this question again? I think that CLMPI should be directly connected to gate terminal of power mosfets with 0Ohms resistor, but I am not sure.
2. If the CLMPI pin has to be far away from its connection target, could you please give some suggestions to keep AMC function effective. For example, if the extra BJT-CB is introduced, AMC loop becomes longer with increased impedance, which would negatively affect AMC performance. I found some people connect CLMPI pin with an external PNP transistor (is placed next to gate terminal) to form AMC function. How do you think about this kind of method and do you have any suggestions to implement this method? Or do you have any other better solutions?
Since we are using ucc21750 to drive expensive mosfets. Any valuable information you provided will help us reduce the risk. Appreciate your response and help.
Bests,
Zack